Stress analysis of single lap bonded joints (adhesive and adherends)
Abstract:ESDU 92041 introduces a Fortran program (ESDUpac A9241) for calculating the shear stress distribution in the adhesive along a joint; it is assumed invariant across the width of the joint. Two options are provided: a simple shear stress analysis (sometimes called shear lag analysis) which neglects all out-of-plane considerations and a flexible joint analysis of both shear and peel stresses. The joint geometry, adhesive and adherend properties, and load are the required input to the program. The first option allows analysis of either tension or shear loading and either elastic or inelastic adhesive properties. The second option only treats tensile loading and elastic adhesive properties. In both cases the adherends may be of different thicknesses and/or different materials. In the case of the flexible joint analysis, when the adherends have different coefficients of thermal expansion, account can be taken of stresses induced by temperature change from the stress-free (curing) temperature. The simple shear stress analysis also provides the stress and strain distribution along the adherends. The program will accept a range of overlap lengths and/or adhesive shear moduli and will determine the case giving the smallest peak stress in the adhesive. Notes on typical adhesive stress distributions and possible failure modes are included and the theoretical background to the program is explained in detail. The input to and the output from the program are detailed and illustrated with fully worked examples.
|Data Item ESDU 92041|
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